Measuring the bending of diode laser bars

The purpose of the μSMILE testing device is the quantification of the bending of diode laser bars after attachment to the cooling submount in the direction vertical to the p-n plane. This effect is traditionally called “SMILE”. The measuring concept consists of the active imaging of the diode laser light emission with a special anamorphotic optical system, with a high magnification in the direction of the SMILE. The specific features of the new measurement device are the integration of aspheric cylindrical lenses and the use of standard CMOS camera technology. The achieved lateral resolution in SMILE axis is < 45nm. Within this lecture we will present the optical design layout of the μSMILE testing device. The main features of the associated control software will be demonstrated and finally some measurement results will be shown.