TriPleX™: A Low-Loss Photonic Platform for Large-Scale Photonic Integration from Visible to Infra-Red

LioniX B.V., Enschede, Netherlands

a.leinse@lionixbv.nl

Abstract

In the emerging field of integrated optics the development of stable platforms becomes more and more important. A stable platform with design kits and libraries of building blocks allows users to design devices on system level similar to the electronic IC industry. The TriPleX™ technology of LioniX is one of the three main photonic platforms in Europe (next to InP and SOI) and the low loss properties over a large wavelength range (405 nm to 2.35 µm) make it extremely suitable for a variety of applications. The platform is based on LPCVD silicon nitride (Si3N4) and SiO2, and adiabatic spot size converters can be realized on chip to achieve low-loss coupling to fibers and other photonic platforms. LioniX developed building blocks in this technology which are offered in Multi Project Wafer (MPW) runs allowing users to have easy access to the technology. In the presentation, an overview of the technology, the MPW process, the buiding blocks and examples of applications over a broad wavelength range will be shown.

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@inproceedings{dgao115-s3, title = {TriPleX™: A Low-Loss Photonic Platform for Large-Scale Photonic Integration from Visible to Infra-Red}, author = {Arne Leinse}, booktitle = {DGaO-Proceedings, 115. Jahrestagung}, year = {2014}, publisher = {Deutsche Gesellschaft für angewandte Optik e.V.}, issn = {1614-8436}, note = {Vortrag S3} }
115. Jahrestagung der DGaO · Karlsruhe · 2014